Veuillez noter que le programme est rédigé en anglais puisque les présentations seront faites en anglais

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Performance-based Design of Corrugated Box and Board
Organized by the PAPTAC Paperboard Packaging Community / Organisé par la Communauté carton d'emballage de PAPTAC
About the Paperboard Packaging Community / À propos de la Communauté carton d'emballage
Join this Community / Joindre cette Communauté

  When / quand: May 7, 2013
13:00 – 14:00 ET

 
Registration / inscription: Free for PAPTAC members / Gratuit pour les membres
  Speaker / Conférencier: Dr. Tetsu Uesaka
Mid Sweden University
 

E-mail Carmie Lato at (clato@paptac.ca) to confirm your presence or call 514-392-6969.

This seminar concerns fundamental rethinking of the “strength-based” design criteria for corrugated boxes and boards.

Currently corrugated box and board are designed and manufactured according to the strength specs, such as BCT, SCCT, RCT and SCT. As the market moves toward greener packaging (less-waste, less-cost, and less carbon footprint), the box and board manufacturers are trying to meet both these demands and the strength specs. However, the task is becoming increasingly difficult, because this subject is not new and the industry in fact has already worked on it for decades. The basic question today is what else we can do to improve/maintain strength with reduced weight (and reduced cost).


 

Tetsu Uesaka is currently professor and chair of materials technology at Mid Sweden University in Sweden. He has been working in pulp and paper area for more than 30 years, with a career spanning both industrial and academic, starting from Sate University of New York in Syracuse as post-doctor fellow, Oji Paper Company as product development engineer and research manager, Pulp and Paper Research Institute of Canada (Paprican) as program manager, and FPInnovations as principal scientist.

He specializes in physics of fibre, paper, board and papermaking systems, and has addressed a number of long-standing end-use performance issues of paper and board through fundamental analysis and practical implementation. He has given numerous technical presentations at the conferences, universities and mill sites. He is a recipient of J. A. Van den Akker award in 2003 and 2007 (the most significant contribution in the field of physics of paper), as well as other best paper awards. He received B.Sc. from Shinshu University, and M.Sc. and Ph.D. from Kyoto University, Japan.

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